First on-line multi-layer reaction chamber dual vacuum system, unchanged footprint, doubled production capacity

OAK-DU-5 with dual react-chamber doubled throughput and kept the same floor space of OAK-U-5.

 Rapid plasma stabilization (stabilization time ~ 0.3 seconds), RF frequency can be selected between 13.56MHz and 40.68MHz

Plasma stabilized within 0.3 seconds with either 13.56 or 40.68 MHz.

 The entire CVD process is in an ultra-clean environment without cross-contamination

The entire CVD processes are under no contamination and super clean environment

 Full automatic production from Jingzhou to Jingzhou, no belt cell transfer

Cassette in, cassette out, wafer load and unload, fully automated without using belt to transfer wafers

 Optimized process and online tray cleaning to maximize equipment productivity

In-line auto-cleaning of wafer carriers integrated with PECVD deposition processes to provide maximum throughout

 Equipped with a plasma self-cleaning system to keep the reaction chamber clean, no need to open the cavity for maintenance, and increase the normal operating time

Dry Clean: keeps chamber complete clean, no need to open chamber clean with better uptime

 Small reaction chamber volume, saving process gas consumption (only traditional ~ 1/8)

Smaller reactor chamber design, saves special reactive gases usage (only ～ 1/8 of traditional chamber)