   Innovated in-line , multi-layer chambers, vacuum-in-vacuum systems with same floor space of OAK-U-5 but double the throughput
 

   Plasma stabilized within 0.1 seconds with either 13.56 or 40.68 MHz

   Entire CVD System is either under vacuum or cleaning environment, no contamination

   From cassette-to-cassette, fully automated wafer transferring without using belt

  Integrated chambers and carriers in-line cleaning, maximize productivity

   Process Chambers equipped with RF self-clean de-contamination apparatus, no need to open chamber clean and maximize production time

   Small chambers (~1/8 of traditional ones), reduce reactive/cleaning gases usage