   Innovated in-line , multi-layer chambers, vacuum-in-vacuum systems

   Plasma stabilized within 0.1 seconds with either 13.56 or 40.68 MHz
 

   The entire CVD processes are under no contamination and super clean environment

   Cassette in, cassette out, wafer load and unload, fully automated without using belt to transfer wafers

   In-line auto-cleaning of wafer carriers integrated with PECVD deposition processes to provide maximum throughout

   Dry Clean: keeps chamber complete clean, no need to open chamber clean with better uptime

   Smaller reactor chamber design, saves special reactive gases usage (only ～1/8 of traditional chamber)