First on-line multi-layer reaction chamber dual vacuum system, unchanged footprint, doubled production capacity
OAK-DU-5 with dual react-chamber doubled throughput and kept the same floor space of OAK-U-5.
Rapid plasma stabilization (stabilization time ~ 0.3 seconds), RF frequency can be selected between 13.56MHz and 40.68MHz
Plasma stabilized within 0.3 seconds with either 13.56 or 40.68 MHz.
The entire CVD process is in an ultra-clean environment without cross-contamination
The entire CVD processes are under no contamination and super clean environment
Full automatic production from Jingzhou to Jingzhou, no belt cell transfer
Cassette in, cassette out, wafer load and unload, fully automated without using belt to transfer wafers
Optimized process and online tray cleaning to maximize equipment productivity
In-line auto-cleaning of wafer carriers integrated with PECVD deposition processes to provide maximum throughout
Equipped with a plasma self-cleaning system to keep the reaction chamber clean, no need to open the cavity for maintenance, and increase the normal operating time
Dry Clean: keeps chamber complete clean, no need to open chamber clean with better uptime
Small reaction chamber volume, saving process gas consumption (only traditional ~ 1/8)
Smaller reactor chamber design, saves special reactive gases usage (only ～ 1/8 of traditional chamber)